The 1st encompassing treatise of this new, yet extremely important box places the recognized actual obstacles for traditional second electronics into point of view with the necessities for additional electronics advancements and industry must haves. This two-volume instruction manual provides 3D suggestions to the function density challenge, addressing all vital matters, resembling wafer processing, die bonding, packaging know-how, and thermal features. It starts off with an introductory half, which defines worthy targets, latest concerns and relates 3D integration to the semiconductor roadmap of the undefined, ahead of happening to hide processing know-how and 3D constitution fabrication techniques intimately. this can be by way of fields of program and a glance on the way forward for 3D integration. The contributions come from key avid gamers within the box, from either academia and undefined, together with such businesses as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
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